Okdo RM116-D2E16W2 55 x 40 mm Compute Module

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Subtotal (1 box of 500 units)*

HK$301,672.50

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Per Box*
500 - 500HK$603.345HK$301,672.50
1000 - 1000HK$579.212HK$289,606.00
1500 +HK$561.835HK$280,917.50

*price indicative

RS Stock No.:
250-2780
Mfr. Part No.:
RM116-D2E16W2
Manufacturer:
Okdo
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Brand

Okdo

Product Type

Compute Module

Supported Video Ports

DVP

Form Factor

55 x 40 mm

Interface Type

LAN

Supported Memory Technology

LPDDR4X

Core Processor

Quad Core Arm

Standards/Approvals

CE

Height

55mm

Series

RM116

COO (Country of Origin):
CN
The ROCK 3 Compute Module (CM3) is a System on Module (SoM) based on a powerful Rockchip RK3566 System on Chip (SoC), Quad-core Arm® Cortex®-A55 CPU and Arm Mali™-G52-2EE GPU. This CM3 is designed to increase the performance and capabilities of your design applications. With a 2GB LPDDR4 RAM, 16GB eMMC flash storage and wireless connectivity, including WiFi 5 and Bluetooth® 5.0, and many other class-leading features incorporated in this compact board of just 55mm x 40mm, the ROCK 3 Compute Module can be easily integrated into different industrial and multimedia projects. CM3 is developed by OKdo Technology in collaboration with Radxa, providing an out-of-the-box, cost-efficient solution that expands the capabilities of various embedded applications.

Key features of the ROCK CM3 2GB:


Rockchip RK3566 SoC with 64-bit Quad Core low power cores up to 2.0GHz

GPU: Arm Mali™-G52-2EE, OpenGL® ES1.1/2.0/3.0/3.1/3.2, Vulkan® 1.1, OpenCL™ 2.1

CPU: Quad-core Arm® Cortex®-A55 (ARMv8) 64-bit @ 2.0GHz

NPU: 1 TOPs@INT8, support INT8, INT16, FP16, BFP16, support deep learning frameworks such as TensorFlow, Caffe, Tflite, Pytorch, Onnx, Android™ NN, etc.

RAM: 2GB LPDDR4

Memory: 32bit DDR4/3/3L/LPDDR4/4X/3 and support eMMC 5.1 and SFC

Display: Single display engine, HDMI2.0, eDP 1.3, Dual MIPI-DSI, combo with single LVDS, 24bit RGB/BT1120 and EBC interface

Multimedia: 4K H.265/H.264/VP9 video decoder and 1080p@60fps H.264/H.265 video encoder

Video input: 8M Pixel ISP and 1 x 4 lanes or 2 x 2 lanes MIPI CSI-2 and DVP interface

Audio interface: I2S0/I2S1 with 8 channels, IS2/I2S3 with 2 channels, SPDIF0, PDM0 with 8 channels, TDM) with 8 channels and Voice Activity Detection (VAD).

High-Speed Interface: One USB 3.0 host, two SATA 3.0, one PCIE2.1, two SerDes (serialiser/deserialiser) lanes, dual USB 2.0 host and one USB 2.0 OTG and a single RGMII interface

Security: Arm TrustZone® security extension, Secure Video Path, Secure JTAG to debug, Secure boot, OTP and Crypto (AES/TDES/SM4/SM3/SHA256/SHA512/RSA)

Power Requirements: the power input into the SoM is 5VDC at 5A.

Interfaces:


802.11 b/g/n/ac Wireless LAN (Wi-Fi 5)

Bluetooth 5.0 with BLE

8 x I2C

4 x SPI

8 x UART

9 x PWM

50 x GPIO

2 x ADC

1 x Gigabit Ethernet PHY

Support PDM with microphone array

I2S

2 x SATA

1 x PCIe 2.0, 1 lane host (5Gbps)

1 x USB 2.0

1 x USB 2.0 OTG

1 x USB 3.0 (5Gbps)

1 x SDIO 3.0

1 x HDMI up to 4K x 2k@60Hz

1 x eDP four lanes (2.7 Gbps per lane)

2 x MIPI DSI @ 1.6Gbps per lane

2 x MIPI CSI

1 x 2 lane MIPI CSI camera port

1 x 4 lane MIPI CSI camera port

1 x LVDS combo four lanes, mux with MIPI DSIO

eMMC size: 16GB

3 x 100 pins 0.4mm pitch B2B connector

Supported Software:


Debian/Ubuntu Linux support

Android 11 support

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