Radxa Bulk ROCK 3 Compute Module (CM3) Model A 2GB Box of 500

RS Stock No.:: 260-0891
Mfr. Part No.:: RM116-D2E0W0S
Manufacturer:: Radxa

Radxa Bulk ROCK 3 Compute Module (CM3) Model A 2GB Box of 500

Bulk discount available

Price Each (In a Box of 500)**

HK$276.452

1500 In stock for delivery within 3 working days*

* Delivery dates may change based on your chosen quantity and delivery address.

FREE delivery for orders over HK$850.00

Units	Per unit	Per Box**
500 - 500	HK$276.452	HK$138,226.00
1000 - 1000	HK$266.678	HK$133,339.00
1500 +	HK$254.731	HK$127,365.50

**price indicative

RS Stock No.:: 260-0891
Mfr. Part No.:: RM116-D2E0W0S
Manufacturer:: Radxa

RoHS Status: Exempt

COO (Country of Origin):: CN

The ROCK 3 Compute Module (CM3) is a System on Module (SoM) based on a powerful Rockchip RK3566 System on Chip (SoC), Quad-core Arm® Cortex®-A55 CPU and Arm Mali™-G52-2EE GPU. This CM3 is designed to increase the performance and capabilities of your design applications. With a 2GB LPDDR4 RAM, and many other class-leading features incorporated in this compact board of just 55mm x 40mm, the ROCK 3 Compute Module can be easily integrated into different industrial and multimedia projects. CM3 is developed by OKdo Technology in collaboration with Radxa, providing an out-of-the-box, cost-efficient solution that expands the capabilities of various embedded applications.

Key features of the ROCK CM3 2GB:

Rockchip RK3566 SoC with 64-bit Quad Core low power cores up to 2.0GHz

GPU: Arm Mali™-G52-2EE, OpenGL® ES1.1/2.0/3.0/3.1/3.2, Vulkan® 1.1, OpenCL™ 2.1

CPU: Quad-core Arm® Cortex®-A55 (ARMv8) 64-bit @ 2.0GHz

NPU: 1 TOPs@INT8, support INT8, INT16, FP16, BFP16, support deep learning frameworks such as TensorFlow, Caffe, Tflite, Pytorch, Onnx, Android™ NN, etc.

RAM: 2GB LPDDR4

Display: Single display engine, HDMI2.0, eDP 1.3, Dual MIPI-DSI, combo with single LVDS, 24bit RGB/BT1120 and EBC interface

Multimedia: 4K H.265/H.264/VP9 video decoder and 1080p@60fps H.264/H.265 video encoder

Video input: 8M Pixel ISP and 1 x 4 lanes or 2 x 2 lanes MIPI CSI-2 and DVP interface

Audio interface: I2S0/I2S1 with 8 channels, IS2/I2S3 with 2 channels, SPDIF0, PDM0 with 8 channels, TDM) with 8 channels and Voice Activity Detection (VAD).

Security: Arm TrustZone® security extension, Secure Video Path, Secure JTAG to debug, Secure boot, OTP and Crypto (AES/TDES/SM4/SM3/SHA256/SHA512/RSA)

Power Requirements: the power input into the SoM is 5VDC at 5A.

Interfaces:

8 x I2C

4 x SPI

8 x UART

9 x PWM

50 x GPIO

2 x ADC

1 x Gigabit Ethernet PHY

Support PDM with microphone array

I2S

2 x SATA

1 x PCIe 2.0, 1 lane host (5Gbps)

1 x USB 2.0

1 x USB 3.0 (5Gbps)

1 x SDIO 3.0

1 x HDMI up to 4K x 2k@60Hz

2 x MIPI DSI @ 1.6Gbps per lane

2 x MIPI CSI

1 x 2 lane MIPI CSI camera port

1 x 4 lane MIPI CSI camera port

1 x LVDS combo four lanes, mux with MIPI DSIO

3 x 100 pins 0.4mm pitch B2B connector

Supported Software:

Debian/Ubuntu Linux support

Android 11 support

Attribute	Value
Product Name	Bulk ROCK 3 Compute Module (CM3) Model A 2GB Box of 500
RAM Size	2GB
Model Number	Compute Module 3