Infineon HEXFET N-Channel MOSFET, 76 A, 200 V Enhancement TO-220 IRFB4127PBF

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Subtotal (1 tube of 100 units)*

HK$2,298.50

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  • 700 unit(s) ready to ship from another location
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Units
Per unit
Per Tube*
100 - 400HK$22.985HK$2,298.50
500 - 900HK$22.526HK$2,252.60
1000 +HK$22.074HK$2,207.40

*price indicative

RS Stock No.:
257-5514
Mfr. Part No.:
IRFB4127PBF
Manufacturer:
Infineon
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Brand

Infineon

Channel Type

N

Product Type

MOSFET

Maximum Continuous Drain Current Id

76A

Maximum Drain Source Voltage Vds

200V

Series

HEXFET

Package Type

TO-220

Mount Type

PCB

Maximum Drain Source Resistance Rds

20mΩ

Channel Mode

Enhancement

Maximum Gate Source Voltage Vgs

20V

Forward Voltage Vf

1.3V

Maximum Power Dissipation Pd

375W

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

175°C

Standards/Approvals

RoHS

Automotive Standard

No

Infineon HEXFET Series MOSFET, 200V Maximum Drain-Source Voltage, 375W Maximum Power Dissipation - IRFB4127PBF


This MOSFET is a high-voltage, enhancement-mode N-channel transistor designed for PCB mounting in a TO-220 package. It is intended for power switching and control tasks where substantial current handling and thermal capacity are required, and it operates across an extended industrial temperature range while meeting RoHS restrictions.

Features and Benefits:


• 20mΩ Rds(on) enabling reduced conduction losses
• 76A continuous drain current supporting high-load switching
• 200V drain-source rating permitting high-voltage applications
• 375W power dissipation improving thermal headroom
• 1.3V forward voltage minimising gate drive drop

Applications


• Suitable for power-supply switching in industrial systems
• Used with motor drivers requiring high current handling
• Ideal for DC-DC converters in high-voltage rails
• Can be used for inverter-stage switching on PCBs

What gate voltage limits must be observed?


The gate-to-source voltage must not exceed 20V to avoid damaging the gate dielectric.

What temperature range can it withstand during operation?


It is specified to function between -55°C and 175°C for broad industrial use.

Is the device suitable for surface mounting on circuit boards?


It is intended for PCB mounting in a through-hole TO-220 package for secure thermal and mechanical attachment.

Does it conform to environmental material restrictions?


The component is RoHS-compliant, meeting required restrictions on hazardous substances.

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