Infineon BSS Type N-Channel MOSFET, 2.30 A, 30 V Enhancement, 3-Pin SOT-23 BSS306NH6327XTSA1

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HK$2,361.00

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3000 - 3000HK$0.787HK$2,361.00
6000 - 6000HK$0.763HK$2,289.00
9000 +HK$0.74HK$2,220.00

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RS Stock No.:
250-0555
Mfr. Part No.:
BSS306NH6327XTSA1
Manufacturer:
Infineon
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Brand

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

2.30A

Maximum Drain Source Voltage Vds

30V

Series

BSS

Package Type

SOT-23

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

57mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

80nC

Forward Voltage Vf

1V

Maximum Gate Source Voltage Vgs

20V

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

81W

Maximum Operating Temperature

+150°C

Standards/Approvals

RoHS

Automotive Standard

AEC-Q101

Infineon BSS Series MOSFET, 30V Maximum Drain-Source Voltage, 2.30A Maximum Continuous Drain Current - BSS306NH6327XTSA1


This MOSFET is an N-channel enhancement device designed for surface-mount power switching in Compact assemblies. It operates across a wide temperature range and is suitable for demanding environments requiring low conduction losses and moderate switching capability. The package supports automated placement and is compatible with typical board-level thermal management approaches.

Features and Benefits:


• 57mΩ RDS(on) reduces conduction losses during switching
• 80 nC typical gate charge enables controlled switching transitions
• 81W power dissipation supports high single-package power handling
• 20V gate tolerance allows flexibility in gate-drive choice
• -55°C to +150°C rating sustains operation in extreme temperatures

Applications


• Suitable for automotive sensor power switching
• Ideal for Compact DC power management circuits
• Used with low-voltage motor drivers and load switches
• Can be used for battery protection and distribution modules
• Suitable for surface-mounted power supply regulation

What thermal range can it reliably operate within?


It is rated to function from -55°C up to +150°C for high-temperature applications.

How does the gate voltage limitation affect drive selection?


The gate can tolerate up to 20V, so driver designs should not exceed this to prevent gate stress.

What package and mounting style does it use?


It is supplied in a SOT-23 package intended for surface mounting and suitable for automated PCB assembly.

What conduction performance can be expected during on-state?


The device exhibits a maximum drain-source resistance of 57mΩ, lowering voltage drop under load.

Is it suitable for regulated power dissipation scenarios?


It supports a maximum power dissipation of 81W, allowing use in moderately high-power single-device applications.

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