Vishay EF Type N-Channel Power MOSFET, 26 A, 650 V Depletion, 4-Pin PowerPAK 8 x 8 SiHH105N60EF-T1GE3
- RS Stock No.:
- 239-8632
- Mfr. Part No.:
- SiHH105N60EF-T1GE3
- Manufacturer:
- Vishay
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Subtotal (1 unit)*
HK$45.50
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- 1,494 unit(s) ready to ship from another location
Units | Per unit |
|---|---|
| 1 - 49 | HK$45.50 |
| 50 - 99 | HK$44.70 |
| 100 - 249 | HK$43.90 |
| 250 - 999 | HK$43.10 |
| 1000 + | HK$42.30 |
*price indicative
- RS Stock No.:
- 239-8632
- Mfr. Part No.:
- SiHH105N60EF-T1GE3
- Manufacturer:
- Vishay
Select all | Attribute | Value |
|---|---|---|
| Brand | Vishay | |
| Product Type | Power MOSFET | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 26A | |
| Maximum Drain Source Voltage Vds | 650V | |
| Package Type | PowerPAK 8 x 8 | |
| Series | EF | |
| Mount Type | Surface | |
| Pin Count | 4 | |
| Maximum Drain Source Resistance Rds | 0.091Ω | |
| Channel Mode | Depletion | |
| Maximum Power Dissipation Pd | 174W | |
| Typical Gate Charge Qg @ Vgs | 33nC | |
| Minimum Operating Temperature | -55°C | |
| Forward Voltage Vf | 1.2V | |
| Maximum Gate Source Voltage Vgs | 30V | |
| Maximum Operating Temperature | +150°C | |
| Standards/Approvals | RoHS | |
| Automotive Standard | AEC-Q101 | |
| Select all | ||
|---|---|---|
Brand Vishay | ||
Product Type Power MOSFET | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 26A | ||
Maximum Drain Source Voltage Vds 650V | ||
Package Type PowerPAK 8 x 8 | ||
Series EF | ||
Mount Type Surface | ||
Pin Count 4 | ||
Maximum Drain Source Resistance Rds 0.091Ω | ||
Channel Mode Depletion | ||
Maximum Power Dissipation Pd 174W | ||
Typical Gate Charge Qg @ Vgs 33nC | ||
Minimum Operating Temperature -55°C | ||
Forward Voltage Vf 1.2V | ||
Maximum Gate Source Voltage Vgs 30V | ||
Maximum Operating Temperature +150°C | ||
Standards/Approvals RoHS | ||
Automotive Standard AEC-Q101 | ||
Vishay Series EF Power MOSFET, 650V Drain Source Voltage, 26A Continuous Drain Current - SiHH105N60EF-T1GE3
Features and Benefits:
Applications
What thermal range can this device tolerate during operation?
How does the pin count and mounting affect PCB layout?
What gate‑drive considerations are necessary for reliable switching?
Is the device suitable for automotive qualification requirements?
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