Infineon, 32 bit ARM 32 Bit Cortex M4, XMC4500 Microcontroller, 120 MHz, 1024kB FLASH, 144-Pin LFBGA
- RS Stock No.:
- 260-5250P
- Mfr. Part No.:
- XMC4500E144X1024ACXQSA1
- Manufacturer:
- Infineon
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View bulk pricing optionsSubtotal (10 units, supplied in a tray)*
HK$1,154.00
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- Shipping from 15 July 2027
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Units | Per unit |
|---|---|
| 10 - 24 | HK$115.40 |
| 25 - 49 | HK$105.60 |
| 50 - 99 | HK$103.40 |
| 100 + | HK$98.50 |
*price indicative
- RS Stock No.:
- 260-5250P
- Mfr. Part No.:
- XMC4500E144X1024ACXQSA1
- Manufacturer:
- Infineon
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Series | XMC4500 | |
| Product Type | Microcontroller | |
| Package Type | LFBGA | |
| Mount Type | Surface | |
| Pin Count | 144 | |
| Device Core | ARM 32 Bit Cortex M4 | |
| Data Bus Width | 32bit | |
| Interface Type | USIC, CAN, IIC, IIS, LIN, SPI, UART, USART, USB | |
| Program Memory Size | 1024kB | |
| Maximum Clock Frequency | 120MHz | |
| RAM Size | 160kB | |
| Maximum Supply Voltage | 3.63V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Length | 14mm | |
| Height | 1mm | |
| Number of Programmable I/Os | 91 | |
| Standards/Approvals | RoHS | |
| Width | 14mm | |
| Minimum Supply Voltage | 3.13V | |
| ADCs | 12 bit | |
| Program Memory Type | FLASH | |
| Instruction Set Architecture | Thumb-2 | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Series XMC4500 | ||
Product Type Microcontroller | ||
Package Type LFBGA | ||
Mount Type Surface | ||
Pin Count 144 | ||
Device Core ARM 32 Bit Cortex M4 | ||
Data Bus Width 32bit | ||
Interface Type USIC, CAN, IIC, IIS, LIN, SPI, UART, USART, USB | ||
Program Memory Size 1024kB | ||
Maximum Clock Frequency 120MHz | ||
RAM Size 160kB | ||
Maximum Supply Voltage 3.63V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Length 14mm | ||
Height 1mm | ||
Number of Programmable I/Os 91 | ||
Standards/Approvals RoHS | ||
Width 14mm | ||
Minimum Supply Voltage 3.13V | ||
ADCs 12 bit | ||
Program Memory Type FLASH | ||
Instruction Set Architecture Thumb-2 | ||
Automotive Standard No | ||
Infineon Microcontroller, 32-bit ARM Cortex M4 Core, 1024kByte Program Memory - XMC4500E144X1024ACXQSA1
This microcontroller is designed for robust industrial applications. It features a compact LFBGA package, with a pin count of 144, and includes a powerful 32-bit ARM Cortex M4 processor that operates at frequencies of up to 120MHz. The device boasts an extensive program memory capacity of 1024kByte and offers operating temperature
Features & Benefits
• 128 to 160KB RAM ensures efficient data handling
• Four 12-bit ADCs provide precise signal measurement
• Integrated Flash memory enhances data retention
• Supports a typical operating supply voltage of 3.3V
• Operates effectively at a maximum temperature of +105°C
Applications
• Utilised in automation control systems for enhanced productivity
• Suitable for motor control in various machinery
• Implemented in power conversion systems for efficiency
• Used for industrial sensing and control tasks
• Applied in connectivity solutions across diverse industrial sectors
What specifications ensure this microcontroller is suitable for automation tasks?
The microcontroller's three CAN channels facilitate seamless communication in automation networks. Its high processing speed of 120MHz ensures rapid data processing, vital for automation tasks, while the ADCs provide accurate sensing capabilities.
How does the memory capacity influence the capabilities of this microcontroller?
The onboard Flash memory of 1024kByte allows for extensive programme storage, which is crucial for complex applications requiring large data sets or sophisticated algorithms.
How does the LFBGA package facilitate the microcontroller’s use in various applications?
The LFBGA package provides a compact footprint while maintaining the robust connectivity needed for industrial applications, supporting high-density designs and effective thermal management.
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