Winslow Straight Through Hole Mount 0.5 mm, 2.54 mm Pitch IC Socket Adapter, TSOP 40 to DIP 40
- RS Stock No.:
- 741-9445
- Mfr. Part No.:
- W9530RC
- Manufacturer:
- Winslow
The image is for reference only, please refer to product details and specifications
Bulk discount available
Subtotal (1 unit)*
HK$201.00
FREE delivery for orders over HK$250.00
In Stock
- 3 unit(s) ready to ship from another location
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Units | Per unit |
|---|---|
| 1 - 24 | HK$201.00 |
| 25 - 99 | HK$195.40 |
| 100 + | HK$187.30 |
*price indicative
- RS Stock No.:
- 741-9445
- Mfr. Part No.:
- W9530RC
- Manufacturer:
- Winslow
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Pitch | 0.5 mm, 2.54 mm | |
| End 1 | TSOP 40 | |
| End 2 | DIP 40 | |
| End 1 Number of Contacts | 40 | |
| End 2 Number of Contacts | 40 | |
| End 1 Type | TSOP | |
| End 2 Type | DIP | |
| End 1 Gender | Female | |
| End 2 Gender | Male | |
| Mounting Type | Through Hole | |
| Body Orientation | Straight | |
| Contact Material | Brass | |
| Contact Plating | Tin over Nickel | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Pitch 0.5 mm, 2.54 mm | ||
End 1 TSOP 40 | ||
End 2 DIP 40 | ||
End 1 Number of Contacts 40 | ||
End 2 Number of Contacts 40 | ||
End 1 Type TSOP | ||
End 2 Type DIP | ||
End 1 Gender Female | ||
End 2 Gender Male | ||
Mounting Type Through Hole | ||
Body Orientation Straight | ||
Contact Material Brass | ||
Contact Plating Tin over Nickel | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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