Winslow Straight Through Hole Mount 1.27 mm, 2.54 mm Pitch IC Socket Adapter, 16 Pin Female SOP to 16 Pin Male DIP
- RS Stock No.:
- 741-9401
- Mfr. Part No.:
- W9503-2RC
- Manufacturer:
- Winslow
Bulk discount available
Subtotal (1 pack of 5 units)*
HK$506.20
FREE delivery for orders over HK$250.00
In Stock
- 130 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Pack* |
|---|---|---|
| 5 - 370 | HK$101.24 | HK$506.20 |
| 375 - 1995 | HK$97.20 | HK$486.00 |
| 2000 + | HK$93.14 | HK$465.70 |
*price indicative
- RS Stock No.:
- 741-9401
- Mfr. Part No.:
- W9503-2RC
- Manufacturer:
- Winslow
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Pitch | 1.27 mm, 2.54 mm | |
| End 1 | 16 Pin Female SOP | |
| End 2 | 16 Pin Male DIP | |
| End 1 Number of Contacts | 16 | |
| End 2 Number of Contacts | 16 | |
| End 1 Type | SOP | |
| End 2 Type | DIP | |
| End 1 Gender | Female | |
| End 2 Gender | Male | |
| Mounting Type | Through Hole | |
| Body Orientation | Straight | |
| Contact Material | Brass | |
| Contact Plating | Tin over Nickel | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Pitch 1.27 mm, 2.54 mm | ||
End 1 16 Pin Female SOP | ||
End 2 16 Pin Male DIP | ||
End 1 Number of Contacts 16 | ||
End 2 Number of Contacts 16 | ||
End 1 Type SOP | ||
End 2 Type DIP | ||
End 1 Gender Female | ||
End 2 Gender Male | ||
Mounting Type Through Hole | ||
Body Orientation Straight | ||
Contact Material Brass | ||
Contact Plating Tin over Nickel | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
SOIC to DIP Sockets
Adaptics’ that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
PCB: Epoxy Fibreglass FR4
IC Sockets-Package Adaptics DIP
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
Related links
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