CTS, 74X 33Ω ±5% Isolated Resistor Array, 4 Resistors, 0.063W total, 0402 (1005M), Convex
- RS Stock No.:
- 179-1239
- Mfr. Part No.:
- 741X083330JP
- Manufacturer:
- CTS
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 179-1239
- Mfr. Part No.:
- 741X083330JP
- Manufacturer:
- CTS
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | CTS | |
| Resistance | 33Ω | |
| Number of Resistors | 4 | |
| Resistor Type | Array | |
| Package/Case | 0402 (1005M) | |
| Power Rating | 0.063W | |
| Termination Style | Convex | |
| Tolerance | ±5% | |
| Case Style | Moulded | |
| Power Rating per Resistor | 0.062W | |
| Circuit Designator | ISOL | |
| Length | 2mm | |
| Depth | 1mm | |
| Height | 0.4mm | |
| Dimensions | 2 x 1 x 0.4mm | |
| Number of Terminals | 8 | |
| Series | 74X | |
| Maximum Operating Temperature | +125°C | |
| Minimum Operating Temperature | -55°C | |
| Temperature Coefficient | ±200ppm/°C | |
| Select all | ||
|---|---|---|
Brand CTS | ||
Resistance 33Ω | ||
Number of Resistors 4 | ||
Resistor Type Array | ||
Package/Case 0402 (1005M) | ||
Power Rating 0.063W | ||
Termination Style Convex | ||
Tolerance ±5% | ||
Case Style Moulded | ||
Power Rating per Resistor 0.062W | ||
Circuit Designator ISOL | ||
Length 2mm | ||
Depth 1mm | ||
Height 0.4mm | ||
Dimensions 2 x 1 x 0.4mm | ||
Number of Terminals 8 | ||
Series 74X | ||
Maximum Operating Temperature +125°C | ||
Minimum Operating Temperature -55°C | ||
Temperature Coefficient ±200ppm/°C | ||
- COO (Country of Origin):
- JP
74x Series Chip Arrays are single packaged devices containing an array of homogeneous resistor elements. Arrays are typically used for convenience when several resistors occupy the same area in a layout. Multiple package sizes and circuit configurations help save placement costs by reducing application component count.
Low Cost Thick Film Technology
Leadless Surface Mount Construction
Concave or Convex Terminations
Solder Coated Nickel Barrier Pads
Isolated and Bussed Circuit Configurations
Improved TCR Tracking vs. Discrete Resistors
Fewer Placements Than Discrete Components
Tape and Reel Packaging
Applications:
Data Communications
Image Processing
Medical Equipment
Networking
Pull-Up/Pull-Down Logic Gates
DDR SDRAM, MDDR, DRAM
Portable Test Equipment
Low Profile High Density Designs
Leadless Surface Mount Construction
Concave or Convex Terminations
Solder Coated Nickel Barrier Pads
Isolated and Bussed Circuit Configurations
Improved TCR Tracking vs. Discrete Resistors
Fewer Placements Than Discrete Components
Tape and Reel Packaging
Applications:
Data Communications
Image Processing
Medical Equipment
Networking
Pull-Up/Pull-Down Logic Gates
DDR SDRAM, MDDR, DRAM
Portable Test Equipment
Low Profile High Density Designs