Molex PMC Mezzanine Series Straight Surface Mount PCB Socket, 64-Contact, 2-Row, 1.0mm Pitch, Solder Termination
- RS Stock No.:
- 797-6617
- Mfr. Part No.:
- 71439-0864
- Manufacturer:
- Molex
The image is for reference only, please refer to product details and specifications
Bulk discount available
Subtotal (1 unit)*
HK$41.00
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In Stock
- 151 unit(s) ready to ship from another location
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Units | Per unit |
|---|---|
| 1 - 24 | HK$41.00 |
| 25 - 99 | HK$39.80 |
| 100 - 249 | HK$38.50 |
| 250 - 499 | HK$37.50 |
| 500 + | HK$36.70 |
*price indicative
- RS Stock No.:
- 797-6617
- Mfr. Part No.:
- 71439-0864
- Manufacturer:
- Molex
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Number of Contacts | 64 | |
| Number of Rows | 2 | |
| Pitch | 1.0mm | |
| Mounting Type | Surface Mount | |
| Body Orientation | Straight | |
| Connector System | Board to Board | |
| Termination Method | Solder | |
| Current Rating | 1.0A | |
| Voltage Rating | 100.0 V | |
| Series | PMC Mezzanine | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Series Number | 71439 | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Number of Contacts 64 | ||
Number of Rows 2 | ||
Pitch 1.0mm | ||
Mounting Type Surface Mount | ||
Body Orientation Straight | ||
Connector System Board to Board | ||
Termination Method Solder | ||
Current Rating 1.0A | ||
Voltage Rating 100.0 V | ||
Series PMC Mezzanine | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Series Number 71439 | ||
- COO (Country of Origin):
- US
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component
For these non-cancellable (NC), and non-returnable (NR) products, Terms and Conditions apply.
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