Molex C-Grid III Series Vertical Through Hole PCB Header, 8 Contact(s), 2.54mm Pitch, 2 Row(s), Unshrouded

90120, 90121, 90122 and 90131 series PCB headers that form part of the 2.54 mm C-Grid III interconnection system designed to meet the latest industry requirements. These C-Grid III PCB headers mate with C-Grid III series PCB sockets and crimp housings for use in both board to board and wire to board applications. The headers have a breakaway design and can be cut to size for additional design flexibility. The pins of these PCB pin headers have a high retention force for a secure mating connection. The contacts, once soldered to the PCB also have a high mechanical stability. These 2.54 mm C-Grid PCB pin headers are available in single and dual row, vertical and right angle mounting configurations to suit a range of interconnection requirements.

• Suitable for use in board to board and wire to board applications
• Breakaway feature for design flexibility
• High pin retention force for secure mating connection
• High mechanical stability once soldered

C-Grid III series connectors are suitable for use in the industrial, computer, medical, consumer, telecommunications and transportation industry. Applications include Desktop PCs, servers, monitors, medical equipment, white goods, exchange stations, industrial equipment and automotive safety systems and electronics.

This PCB header is a C-Grid III connector designed for versatile applications within the electronics sector. With a pitch of 2.54mm, it features a dual-row layout accommodating 8 circuits and operates with a vertical orientation. This through-hole PCB header is constructed from durable brass and features a gold-plated finish for enhanced conductivity.

• 8 contact PCB header ensures reliable connections
• 3A current rating supports various low-power applications
• 350V voltage rating enhances durability in demanding environments
• Vertical design facilitates space-efficient circuit layouts
• Unshrouded connectors simplify component placement
• Compatibility with wire-to-board configurations for enhanced versatility

• Utilised in automation and control systems
• Ideal for electronic devices requiring reliable signal connections
• Employed in industrial machinery for robust wiring solutions
• Suitable for custom circuit board designs in varied environments

Gold plating improves conductivity and resistance to corrosion, ensuring long-lasting performance and reliability in signal transmission.

The vertical orientation allows for compact arrangements, making it easier to fit within tight spaces and enabling efficient board layout designs.

Yes, it operates within a temperature range from -55°C to +125°C, making it suitable for diverse settings, including high-temperature environments.

Yes, it serves effectively for both signal and low-power transmission applications, providing flexibility in circuit design.

The header can withstand a maximum process temperature of 230°C during soldering, ensuring reliable installation.

DIN 41651; HE13/14

2.54mm Molex C-Grid III Range