Specifications

Product overview and Technical data sheets

Legislation and Compliance

Product Details

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Select all	Attribute	Value
	Brand	Amphenol Communications Solutions
	Series	Bergstik
	Product Type	Pin Header
	Pitch	2.54mm
	Current	3A
	Housing Material	Thermoplastic
	Number of Contacts	2
	Number of Rows	1
	Orientation	Vertical
	Shrouded/Unshrouded	Unshrouded
	Mount Type	Through Hole
	Connector System	Board-to-Board
	Contact Plating	Gold
	Contact Material	Phosphor Bronze
	Termination Type	Solder
	Row Pitch	2.54mm
	Minimum Operating Temperature	-65°C
	Tail Pin Length	2.9mm
	Contact Gender	Male
	Maximum Operating Temperature	125°C
	Mating Pin Length	5.84mm
	Standards/Approvals	CHINA RoHS, EU RoHS, REACH/SvHC
	Voltage	1500 V

	Select all
	Brand Amphenol Communications Solutions
	Series Bergstik
	Product Type Pin Header
	Pitch 2.54mm
	Current 3A
	Housing Material Thermoplastic
	Number of Contacts 2
	Number of Rows 1
	Orientation Vertical
	Shrouded/Unshrouded Unshrouded
	Mount Type Through Hole
	Connector System Board-to-Board
	Contact Plating Gold
	Contact Material Phosphor Bronze
	Termination Type Solder
	Row Pitch 2.54mm
	Minimum Operating Temperature -65°C
	Tail Pin Length 2.9mm
	Contact Gender Male
	Maximum Operating Temperature 125°C
	Mating Pin Length 5.84mm
	Standards/Approvals CHINA RoHS, EU RoHS, REACH/SvHC
	Voltage 1500 V

Datasheet - 77311-818-02LF

COO (Country of Origin):: FR

The Amphenol FCI BergStik 2.54mm unshrouded headers are available in surface-mount (SMT), through-hole (THT), press-fit, stacking and pin-in-paste (PIP) versions. Designed in single and double row. They are available in straight or right angle options, from 2 to 72 positions featuring a “breakaway” design, each connector can be cut or broken to length to suit the application profile. The maximum current rating is 3A per contact. This product range is extended with BergStik 2.54mm unshrouded vertical headers in 0.25μm plating, available in standard sizes. It offers an economical solution for various applications. It is also specified up to 100 mating cycles. BergStik product range provides Board-to-Board, Wire to-Board and Cable-to-Board interconnect solutions for all electronic equipment and devices.

Allow dual entry; mating from top or bottom

Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements

Can be used for wire wrapping

Allows cleaning to remove soldering contamination

Duplex plating

Tin-lead plating in press-fit area

Easy pin insertion onto PCB

Retention legs option

High retention force onto PCB

Amphenol Communications Solutions Bergstik Series Vertical Through Hole Pin Header, 2 Contact(s), 2.54 mm Pitch, 1 Row,

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