Molex 203564 Series Vertical Surface Mount PCB Header, 40 Contact(s), 1 mm Pitch, 2 Row, Shrouded
- RS Stock No.:
- 798-919
- Mfr. Part No.:
- 203564-4017
- Manufacturer:
- Molex
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The image is for reference only, please refer to product details and specifications
Subtotal (1 reel of 1100 units)*
HK$42,489.67
Stock information currently inaccessible - Please check back later
Reel(s) | Per Reel | Per unit* |
|---|---|---|
| 1 + | HK$42,489.67 | HK$38.627 |
*price indicative
- RS Stock No.:
- 798-919
- Mfr. Part No.:
- 203564-4017
- Manufacturer:
- Molex
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Series | 203564 | |
| Product Type | PCB Header | |
| Pitch | 1mm | |
| Housing Material | Polyamide | |
| Number of Contacts | 40 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface Mount | |
| Connector System | Wire-to-Board | |
| Contact Plating | Gold | |
| Contact Material | Bronze | |
| Row Pitch | 1mm | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 100V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Series 203564 | ||
Product Type PCB Header | ||
Pitch 1mm | ||
Housing Material Polyamide | ||
Number of Contacts 40 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface Mount | ||
Connector System Wire-to-Board | ||
Contact Plating Gold | ||
Contact Material Bronze | ||
Row Pitch 1mm | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Voltage 100V | ||
- COO (Country of Origin):
- MY
The Molex PCB Header is designed for efficient connectivity in electronic applications, featuring a dual-row layout and a secure surface mount configuration.
1.00mm pitch design ensures Compact integration within electronic devices
Dual row configuration allows for higher circuit density
Surface mount style facilitates easy PCB assembly
0.38μm gold plating enhances conductivity and durability
Includes an inner positive lock mechanism for secure connections
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