Molex 171974 Series Right Angle Through Hole PCB Header, 4 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 788-083
- Mfr. Part No.:
- 171974-0104
- Manufacturer:
- Molex
N
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 788-083
- Mfr. Part No.:
- 171974-0104
- Manufacturer:
- Molex
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Series | 171974 | |
| Product Type | PCB Header | |
| Current | 3A | |
| Pitch | 2.54mm | |
| Housing Material | Polymer | |
| Number of Contacts | 4 | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Brass | |
| Contact Plating | Tin | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Male | |
| Standards/Approvals | UL | |
| Voltage | 250V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Series 171974 | ||
Product Type PCB Header | ||
Current 3A | ||
Pitch 2.54mm | ||
Housing Material Polymer | ||
Number of Contacts 4 | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Brass | ||
Contact Plating Tin | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Male | ||
Standards/Approvals UL | ||
Voltage 250V | ||
- COO (Country of Origin):
- MY
The Molex PCB header is designed to provide reliable and efficient electrical connections across various applications, optimising performance and durability in demanding environments.
Robust design ensures exceptional reliability in challenging conditions
Facilitates seamless integration with a wide range of existing systems
Offers versatility for various connectivity configurations
Enhances performance with high-speed data transmission capabilities
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