Molex 76829 Series Vertical Through Hole PCB Header, 10 Contact(s), 5.70 mm Pitch, 2 Row, Shrouded

Subtotal (1 tray of 60 units)*

HK$1,958.14

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Tray(s)
Per Tray
Per unit*
1 +HK$1,958.14HK$32.636

*price indicative

RS Stock No.:
693-658
Mfr. Part No.:
76829-0010
Manufacturer:
Molex
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Brand

Molex

Product Type

PCB Header

Series

76829

Current

23.5A

Pitch

5.70mm

Number of Contacts

10

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Plating

Matte Tin

Contact Material

High Conductive Copper Alloy

Row Pitch

5.70mm

Termination Type

Through Hole

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.73mm

Standards/Approvals

EU RoHS Compliant

Mating Pin Length

3.73mm

COO (Country of Origin):
CN
The Molex Mega-Fit Vertical Header is a robust interconnect solution designed for power applications requiring dependable connectivity. Crafted for PCB Headers and Receptacles, this component supports up to 10 circuits and accommodates a maximum current of 23.5A at 600V AC/DC. Its dual-row design features a 5.70mm pitch, ensuring a Compact footprint while also enabling secure mating with other components. The header is built with high conductivity copper for optimal electrical performance and is finished with a matte tin plating, providing durability and corrosion resistance. Ideal for stringent applications, it boasts specifications including glow-wire capability and a temperature range of -40° to +105°C, ensuring reliable operation in various environments.

Supports up to 10 circuits for versatile power connection
Current handling of 23.5A maximises power efficiency
Voltage rating of 600V AC/DC enhances its utility in diverse applications
Glow-wire capable design ensures adherence to safety standards
Vertical orientation and dual-row design save PCB space, optimising layout
Compatible with multiple receptacle options for flexible integration into existing systems

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