TE Connectivity AMPMODU Series Right Angle Board Connector Assembly, 80 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded
- RS Stock No.:
- 679-683
- Mfr. Part No.:
- 9-103330-0
- Manufacturer:
- TE Connectivity
Subtotal (1 box of 15 units)*
HK$1,973.35
FREE delivery for orders over HK$250.00
Temporarily out of stock
- Shipping from 23 January 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Box(es) | Per Box | Per unit* |
|---|---|---|
| 1 + | HK$1,973.35 | HK$131.557 |
*price indicative
- RS Stock No.:
- 679-683
- Mfr. Part No.:
- 9-103330-0
- Manufacturer:
- TE Connectivity
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Series | AMPMODU | |
| Product Type | Connector Assembly | |
| Current | 3A | |
| Pitch | 2.54mm | |
| Number of Contacts | 80 | |
| Housing Material | Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Board | |
| Connector System | Board-to-Board | |
| Contact Plating | Tin | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -65°C | |
| Row Pitch | 2.54mm | |
| Termination Type | Through Hole | |
| Tail Pin Length | 3.05mm | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Series AMPMODU | ||
Product Type Connector Assembly | ||
Current 3A | ||
Pitch 2.54mm | ||
Number of Contacts 80 | ||
Housing Material Thermoplastic | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Board | ||
Connector System Board-to-Board | ||
Contact Plating Tin | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -65°C | ||
Row Pitch 2.54mm | ||
Termination Type Through Hole | ||
Tail Pin Length 3.05mm | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
- COO (Country of Origin):
- MX
The TE Connectivity PCB Mount Header designed for right angle board to board applications, featuring an 80 position configuration with a 2.54 mm centreline. Offering a breakaway feature, this header is crafted for efficient connectivity and is optimised for through hole solder termination. Its robust design ensures reliable performance in a multitude of electronic environments, making it an Ideal choice for high density assemblies. The connector's black thermoplastic housing provides durability, while its nickel underplating and tin plating guarantee superior conductivity and enhanced longevity. With a 3 A contact current rating and compatibility with printed circuit boards, this assembly stands out in the AMPMODU Headers series.
80 positions and 2 rows providing high-density interconnect options
Breakaway header type allows for versatile circuit configurations
Designed for board-to-board connector systems enhancing assembly flexibility
Operates effectively in a temperature range of -65 to 105 °C applicable across diverse environments
Through-hole solder termination method ensures strong mechanical stability
Compliant with EU RoHS and ELV directives supporting environmental standards
Packaging quantity of 50 allows for convenient bulk purchasing for large projects
UL 94V-0 flammability rating enhances safety in electrical applications
Compatible with a variety of components and hardware for expanded connectivity solutions
Breakaway header type allows for versatile circuit configurations
Designed for board-to-board connector systems enhancing assembly flexibility
Operates effectively in a temperature range of -65 to 105 °C applicable across diverse environments
Through-hole solder termination method ensures strong mechanical stability
Compliant with EU RoHS and ELV directives supporting environmental standards
Packaging quantity of 50 allows for convenient bulk purchasing for large projects
UL 94V-0 flammability rating enhances safety in electrical applications
Compatible with a variety of components and hardware for expanded connectivity solutions
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