Infineon HEXFET Type N-Channel Power MOSFET, 48 A, 60 V Enhancement, 3-Pin TO-220AB IRFZ44EPBF
- RS Stock No.:
- 541-1809
- Mfr. Part No.:
- IRFZ44EPBF
- Manufacturer:
- Infineon
The image is for reference only, please refer to product details and specifications
- RS Stock No.:
- 541-1809
- Mfr. Part No.:
- IRFZ44EPBF
- Manufacturer:
- Infineon
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | Power MOSFET | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 48A | |
| Maximum Drain Source Voltage Vds | 60V | |
| Package Type | TO-220AB | |
| Series | HEXFET | |
| Mount Type | Through Hole | |
| Pin Count | 3 | |
| Maximum Drain Source Resistance Rds | 0.023Ω | |
| Channel Mode | Enhancement | |
| Typical Gate Charge Qg @ Vgs | 60nC | |
| Minimum Operating Temperature | -55°C | |
| Maximum Power Dissipation Pd | 110W | |
| Maximum Gate Source Voltage Vgs | 20V | |
| Forward Voltage Vf | 1.3V | |
| Maximum Operating Temperature | 175°C | |
| Length | 10.54mm | |
| Height | 8.77mm | |
| Standards/Approvals | ANSI Y14.5M, JEDEC TO-220AB | |
| Width | 4.69mm | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type Power MOSFET | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 48A | ||
Maximum Drain Source Voltage Vds 60V | ||
Package Type TO-220AB | ||
Series HEXFET | ||
Mount Type Through Hole | ||
Pin Count 3 | ||
Maximum Drain Source Resistance Rds 0.023Ω | ||
Channel Mode Enhancement | ||
Typical Gate Charge Qg @ Vgs 60nC | ||
Minimum Operating Temperature -55°C | ||
Maximum Power Dissipation Pd 110W | ||
Maximum Gate Source Voltage Vgs 20V | ||
Forward Voltage Vf 1.3V | ||
Maximum Operating Temperature 175°C | ||
Length 10.54mm | ||
Height 8.77mm | ||
Standards/Approvals ANSI Y14.5M, JEDEC TO-220AB | ||
Width 4.69mm | ||
Automotive Standard No | ||
Infineon HEXFET Series MOSFET, 48A Maximum Continuous Drain Current, 110W Maximum Power Dissipation - IRFZ44EPBF
Features & Benefits
Applications
What is the maximum gate-to-source voltage for safe operation?
How can this component be effectively mounted?
What happens if the device exceeds its maximum junction temperature?
Can this be used in high-speed switching applications?
What is the typical power dissipation capability at room temperature?
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