Infineon BSL Type P-Channel MOSFET, 5.5 A, -30 V Enhancement, 6-Pin TSOP BSL307SPH6327XTSA1

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Subtotal (1 reel of 3000 units)*

HK$7,233.00

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3000 +HK$2.411HK$7,233.00

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RS Stock No.:
260-5072
Mfr. Part No.:
BSL307SPH6327XTSA1
Manufacturer:
Infineon
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Brand

Infineon

Product Type

MOSFET

Channel Type

Type P

Maximum Continuous Drain Current Id

5.5A

Maximum Drain Source Voltage Vds

-30V

Package Type

TSOP

Series

BSL

Pin Count

6

Maximum Drain Source Resistance Rds

43mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

+150°C

Standards/Approvals

RoHS

Automotive Standard

No

Infineon BSL Series MOSFET -30V Maximum Drain-Source Voltage, 5.5A Maximum Continuous Drain Current - BSL307SPH6327XTSA1


This MOSFET is a P-channel enhancement device supplied in a Compact TSOP package for semiconductor switching tasks. It is suited to applications requiring low on-resistance and moderate current handling across a wide ambient range, operating from low temperatures to elevated temperatures in demanding environments. The device conforms to RoHS requirements and is configured with six pins for PCB mounting and circuit integration.

Features and Benefits:


• 43mΩ Rds(on) reduces conduction losses and improves efficiency
• 5.5A continuous drain current supports moderate power delivery
• -30V drain-source rating enables low-voltage system switching
• -55°C to +150°C temperature range maintains operation under extremes
• TSOP 6‑pin package minimises PCB footprint for Compact designs

Applications


• Used for battery protection in portable electronics
• Suitable for low-voltage power distribution switches
• Ideal for power-path control in handheld devices
• Can be used for polarity-reversal protection circuits
• Used with Compact power modules in space‑limited assemblies

What is the device’s channel type and its switching mode?


It uses a P-type channel and operates in enhancement mode.

How many connection points are available for PCB routing?


The component provides six pins in a TSOP footprint for solder attachment.

Is the device intended for automotive qualification?


It is not specified as meeting automotive-standard qualification.

What environmental compliance does it meet?


The component is manufactured to meet RoHS compliance requirements.

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