Infineon IPD Type P-Channel MOSFET, -73 A, -40 V Enhancement, 3-Pin TO-252 IPD70P04P409ATMA2

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Subtotal (1 reel of 2500 units)*

HK$12,350.00

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  • Shipping from 25 December 2026
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Units
Per unit
Per Reel*
2500 - 2500HK$4.94HK$12,350.00
5000 - 5000HK$4.841HK$12,102.50
7500 +HK$4.744HK$11,860.00

*price indicative

RS Stock No.:
258-3861
Mfr. Part No.:
IPD70P04P409ATMA2
Manufacturer:
Infineon
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Brand

Infineon

Channel Type

Type P

Product Type

MOSFET

Maximum Continuous Drain Current Id

-73A

Maximum Drain Source Voltage Vds

-40V

Package Type

TO-252

Series

IPD

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

8.9mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

75W

Typical Gate Charge Qg @ Vgs

54nC

Forward Voltage Vf

-1V

Maximum Gate Source Voltage Vgs

20V

Maximum Operating Temperature

175°C

Standards/Approvals

DIN IEC 68-1, RoHS

Automotive Standard

AEC-Q101

Infineon IPD Series MOSFET, 75W Power Dissipation -40V Drain-Source Voltage - IPD70P04P409ATMA2


This MOSFET is a P‑channel enhancement‑mode power transistor designed for surface‑mount applications in demanding electrical environments. It operates across a wide temperature span from -55°C to 175°C and is suitable where high current handling and Compact mounting are required. The device complies with RoHS and meets automotive test standard AEC‑Q101 for use in automotive‑grade electronics.

Features and Benefits:


• 8.9mΩ Rds(on) reduces conduction losses and improves efficiency
• -73A continuous drain current supports heavy current demands
• 75W power dissipation allows sustained power handling
• 54 nC typical gate charge enables predictable switching behaviour
• TO‑252 package facilitates Compact surface mounting

Applications


• Suitable for high‑current load switching in automotive systems
• Ideal for reverse‑polarity protection in power rails
• Used with power‑management circuits in vehicular electronics
• Can be used for synchronous control in DC power stages
• Suitable for thermally stable designs across wide temperature ranges

What voltage rating applies between drain and source?


The device is rated for -40V maximum drain‑to‑source voltage.

What gate voltage limits must be observed to avoid damage?


Gate‑to‑source voltage must not exceed 20V to prevent gate stress.

How does the package affect PCB assembly?


The TO‑252 surface‑mount form factor supports standard solder reflow processes and Compact board layouts.

What thermal extremes can the device tolerate during operation?


It is specified for operation from -55°C up to 175°C for wide‑range thermal resilience.

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