Infineon HEXFET N-Channel MOSFET, 24 A, 200 V Enhancement TO-263 IRFS4620TRLPBF

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HK$7,951.20

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800 - 1600HK$9.939HK$7,951.20
2400 +HK$9.741HK$7,792.80

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RS Stock No.:
257-9434
Mfr. Part No.:
IRFS4620TRLPBF
Manufacturer:
Infineon
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Brand

Infineon

Channel Type

N

Product Type

MOSFET

Maximum Continuous Drain Current Id

24A

Maximum Drain Source Voltage Vds

200V

Series

HEXFET

Package Type

TO-263

Mount Type

Through Hole

Maximum Drain Source Resistance Rds

77.5mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

25nC

Maximum Gate Source Voltage Vgs

20V

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

144W

Forward Voltage Vf

1.3V

Maximum Operating Temperature

175°C

Standards/Approvals

RoHS

Automotive Standard

No

Infineon HEXFET Series MOSFET, 200V Maximum Drain-Source Voltage, 24A Maximum Continuous Drain Current - IRFS4620TRLPBF


This MOSFET is an N-channel enhancement-mode power transistor designed for high-voltage switching and power-conversion tasks. It is supplied in a TO-263 package suited to board-mounted power assemblies and operates across an extended temperature span for demanding environments. The device incorporates an intrinsic body diode with a specified forward voltage and is RoHS-compliant.

Features and Benefits:


• 200V rating enables high-voltage switching applications
• 24A continuous current supports substantial load handling
• 77.5mΩ RDS(on) reduces conduction losses during operation
• 144W power dissipation allows elevated thermal loading
• 25 nC typical gate charge yields predictable drive requirements

Applications


• Suitable for high-voltage DC-DC converter stages
• Ideal for switch-mode power-supply output switches
• Used with motor-drive controllers in power assemblies
• Can be used for load-switching in industrial electronics
• Appropriate for power management in non-automotive systems

What gate-drive considerations should I plan for?


Expect a typical total gate charge of 25 nC at VGS

choose a driver that can source and sink sufficient current to achieve the desired switching speed.

How does thermal capability affect PCB design?


With a maximum power dissipation of 144W, ensure adequate copper area or heatsinking and thermal vias to manage junction-to-ambient heat transfer.

What are the limits for control and signal voltages?


The gate may be driven up to 20V relative to source

gate-source excursions should not exceed this value.

What temperature range can it tolerate in operation?


The device is specified to operate from -55°C up to 175°C for wide-temperature applications.

What diode characteristic matters for reverse conduction?


The intrinsic diode presents a forward voltage of 1.3V which influences conduction losses during reverse-current events.

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