Vishay SI3483DDV Type P-Channel MOSFET, -6.4 A, -30 V, 6-Pin TSOP-6
- RS Stock No.:
- 256-7358
- Mfr. Part No.:
- SI3483DDV-T1-GE3
- Manufacturer:
- Vishay
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Subtotal (1 reel of 3000 units)*
HK$5,346.00
FREE delivery for orders over HK$250.00
- Shipping from 03 November 2026
Units | Per unit | Per Reel* |
|---|---|---|
| 3000 - 3000 | HK$1.782 | HK$5,346.00 |
| 6000 - 6000 | HK$1.746 | HK$5,238.00 |
| 9000 + | HK$1.694 | HK$5,082.00 |
*price indicative
- RS Stock No.:
- 256-7358
- Mfr. Part No.:
- SI3483DDV-T1-GE3
- Manufacturer:
- Vishay
Select all | Attribute | Value |
|---|---|---|
| Brand | Vishay | |
| Channel Type | Type P | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | -6.4A | |
| Maximum Drain Source Voltage Vds | -30V | |
| Package Type | TSOP-6 | |
| Series | SI3483DDV | |
| Mount Type | Surface | |
| Pin Count | 6 | |
| Maximum Drain Source Resistance Rds | 0.0513Ω | |
| Maximum Power Dissipation Pd | 3W | |
| Typical Gate Charge Qg @ Vgs | 4.5nC | |
| Minimum Operating Temperature | -55°C | |
| Maximum Gate Source Voltage Vgs | 16V | |
| Forward Voltage Vf | -1.2V | |
| Maximum Operating Temperature | +150°C | |
| Height | 1.1mm | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Vishay | ||
Channel Type Type P | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id -6.4A | ||
Maximum Drain Source Voltage Vds -30V | ||
Package Type TSOP-6 | ||
Series SI3483DDV | ||
Mount Type Surface | ||
Pin Count 6 | ||
Maximum Drain Source Resistance Rds 0.0513Ω | ||
Maximum Power Dissipation Pd 3W | ||
Typical Gate Charge Qg @ Vgs 4.5nC | ||
Minimum Operating Temperature -55°C | ||
Maximum Gate Source Voltage Vgs 16V | ||
Forward Voltage Vf -1.2V | ||
Maximum Operating Temperature +150°C | ||
Height 1.1mm | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
Vishay SI3483DDV Series MOSFET, -30V Maximum Drain Source Voltage, 0.0513Ω Maximum Drain Source Resistance - SI3483DDV-T1-GE3
Features and Benefits:
Applications
What package type is used for Compact PCB layouts?
How does the device behave under high junction temperatures?
What is the typical switching load characteristic to consider in drive design?
Which environmental approvals or material standards apply?
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