Infineon HybridPACK N channel-Channel IGBT Module, 300 A, 1200 V HybridPACK FS410R12A7P1BHPSA1
- RS Stock No.:
- 762-978
- Mfr. Part No.:
- FS410R12A7P1BHPSA1
- Manufacturer:
- Infineon
N
Subtotal (1 unit)*
HK$6,856.19
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In Stock
- Plus 6 unit(s) shipping from 25 May 2026
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Units | Per unit |
|---|---|
| 1 + | HK$6,856.19 |
*price indicative
- RS Stock No.:
- 762-978
- Mfr. Part No.:
- FS410R12A7P1BHPSA1
- Manufacturer:
- Infineon
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | IGBT Module | |
| Channel Type | N channel | |
| Maximum Continuous Drain Current Id | 300A | |
| Maximum Drain Source Voltage Vds | 1200V | |
| Series | HybridPACK | |
| Package Type | HybridPACK | |
| Mount Type | Screw | |
| Typical Gate Charge Qg @ Vgs | 2.95μC | |
| Forward Voltage Vf | 2.03V | |
| Maximum Power Dissipation Pd | 775W | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Height | 17mm | |
| Length | 122mm | |
| Standards/Approvals | RoHS Compliant | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type IGBT Module | ||
Channel Type N channel | ||
Maximum Continuous Drain Current Id 300A | ||
Maximum Drain Source Voltage Vds 1200V | ||
Series HybridPACK | ||
Package Type HybridPACK | ||
Mount Type Screw | ||
Typical Gate Charge Qg @ Vgs 2.95μC | ||
Forward Voltage Vf 2.03V | ||
Maximum Power Dissipation Pd 775W | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Height 17mm | ||
Length 122mm | ||
Standards/Approvals RoHS Compliant | ||
Automotive Standard No | ||
- COO (Country of Origin):
- DE
The Infineon HybridPACK Drive G2 module features a voltage rating of 1200 V and current capabilities of 410 A continuous and 820 A peak. It includes an integrated temperature sensor, low VCE,sat, and low switching losses. The Compact design supports high power density with robust insulation, making it suitable for direct cooling and efficient PCB assembly.
Integrated on-chip temperature sensor
PressFIT contact technology
RoHS compliant, lead-free
UL 94 V0 module frame
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