SPREADFAST Heatsink, Universal Square Ceramic, 20.3°C/W, 38.7 °C/W 6 mm 19 mm 19mm
- RS Stock No.:
- 123-5631
- Mfr. Part No.:
- SF-CHS-191906-PC
- Manufacturer:
- SPREADFAST
Bulk discount available
Subtotal (1 pack of 5 units)*
HK$57.00
FREE delivery for orders over HK$250.00
In Stock
- 5,025 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Pack* |
|---|---|---|
| 5 - 120 | HK$11.40 | HK$57.00 |
| 125 - 245 | HK$10.96 | HK$54.80 |
| 250 - 495 | HK$10.48 | HK$52.40 |
| 500 + | HK$10.30 | HK$51.50 |
*price indicative
- RS Stock No.:
- 123-5631
- Mfr. Part No.:
- SF-CHS-191906-PC
- Manufacturer:
- SPREADFAST
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | SPREADFAST | |
| Product Type | Heatsink | |
| For Use With | Universal Square Ceramic | |
| Length | 19mm | |
| Width | 19mm | |
| Height | 6mm | |
| Fastening | Adhesive, Screw | |
| Thermal Resistance | 20.3, 38.7°C/W | |
| Colour | White | |
| Series | Circular Pin Fin | |
| Standards/Approvals | RoHS | |
| Material | Aluminium Oxide | |
| Select all | ||
|---|---|---|
Brand SPREADFAST | ||
Product Type Heatsink | ||
For Use With Universal Square Ceramic | ||
Length 19mm | ||
Width 19mm | ||
Height 6mm | ||
Fastening Adhesive, Screw | ||
Thermal Resistance 20.3, 38.7°C/W | ||
Colour White | ||
Series Circular Pin Fin | ||
Standards/Approvals RoHS | ||
Material Aluminium Oxide | ||
- COO (Country of Origin):
- CN
Spreadfast SF-CHS Series Round Pin Ceramic Heatsink
Spreadfast SF-CHS series of round pin ceramic heatsinks have been designed as a lower density improvement over traditional metal heatsinks. The innate characteristics of ceramic heatsinks means the SF-CHS series have a high breakdown voltage and heat dissipation. Thanks to the meticulous design of these ceramic heatsinks, the SF-CHS series are ideally suited to applications where thermal cycling stability are required.
Typical Applications
Traditional heatsink replacement.
LED & chipset cooling.
Power modules.
IC cooling.
Ceramic Heatsinks
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