Infineon 1 MB SPI FRAM 8-Pin DSO, FM25V10-GTR

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Subtotal (1 reel of 2500 units)*

HK$245,615.00

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2500 +HK$98.246HK$245,615.00

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RS Stock No.:
273-5330
Mfr. Part No.:
FM25V10-GTR
Manufacturer:
Infineon
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Brand

Infineon

Product Type

FRAM

Memory Size

1MB

Organisation

128K x 8 bit

Interface Type

SPI

Data Bus Width

8bit

Maximum Clock Frequency

40MHz

Package Type

DSO

Pin Count

8

Standards/Approvals

Restriction of hazardous substances (RoHS)

Maximum Operating Temperature

85°C

Number of Bits per Word

8

Maximum Supply Voltage

3.6V

Minimum Operating Temperature

-40°C

Automotive Standard

No

Minimum Supply Voltage

2V

Infineon FRAM, 1MB Memory Size, 8-bit Data Bus Width - FM25V10-GTR


This is a serial non-volatile memory device designed for embedded systems that require persistent data storage with fast SPI access. It operates across a broad supply range and is intended for environments where low-voltage operation and Compact packaging are important. The device is supplied in an 8-pin DSO package suitable for space-constrained boards and conforms to RoHS restrictions.

Features and Benefits:


• Supports 8-bit bus width for straightforward microcontroller interfacing
• Operates from 2V to 3.6V enabling low-voltage system integration
• Provides 40MHz serial clock for high-speed data transfer
• Delivers 1MB capacity suitable for substantial non-volatile storage
• Rated for -40 to 85°C enabling use across industrial temperature ranges

Applications


• Suitable for non-volatile data logging in embedded controllers
• Ideal for configuration storage in low-voltage devices
• Used with SPI-capable microcontrollers for fast memory operations
• Can be used for firmware parameter retention in industrial systems
• Used for Compact memory expansion on space-limited PCBs

What Interface is required to communicate with this device?


It uses an SPI Interface with an 8-bit words-per-transfer format.

What packaging should I expect when mounting onto a PCB?


The module is provided in an 8-pin DSO package for through-hole soldering placement.

How does the device handle hazardous-material restrictions?


It meets RoHS restrictions in its material composition.

Is this suitable for automotive specification requirements?


It is not specified as automotive grade and therefore is offered as a non-automotive alternative.

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