Radxa ROCK 3 Compute Module (CM3) Model B 1GB/8GB WIFI/BT

RS Stock No.:: 256-5015
Mfr. Part No.:: RM116-D1E8W2
Manufacturer:: Radxa

Price Each**

HK$457.60

On back order for despatch 28/03/2025, delivery within 3 working days*

* Delivery dates may change based on your chosen quantity and delivery address.

FREE delivery for orders over HK$850.00

Units	Per unit
1 +	HK$457.60

**price indicative

RS Stock No.:: 256-5015
Mfr. Part No.:: RM116-D1E8W2
Manufacturer:: Radxa

RoHS Status: Exempt

COO (Country of Origin):: CN

The ROCK 3 Compute Module (CM3) is an incredible System on Module (SoM) based on a powerful Rockchip RK3566 System on Chip (SoC) that will boost your design application and enlarge its capabilities. The ROCK CM3 features 1GB LPDDR4 RAM, Quad-core Arm® Cortex®-A55 CPU, Arm Mali™-G52-2EE GPU, DRAM memory, 8GB eMMC flash storage and wireless connectivity, including WiFi 5 and Bluetooth® 5.0. This compute module benefits from multiple outstanding features incorporated in a compact board of just 55mm x 40mm, allowing you to incorporate it into various multimedia and industrial designs easily. Developed by OKdo Technology in collaboration with Radxa, the CM3 offers a cost-efficient solution out of the box for various embedded applications, expanding incredibly the capabilities of your project.

Key features of the ROCK CM3 1GB:

Rockchip RK3566 SoC with 64-bit Quad Core low power cores up to 2.0GHz

CPU: Quad-core Arm® Cortex®-A55 (ARMv8) 64-bit @ 2.0GHz

GPU: Arm Mali™-G52-2EE, OpenGL® ES1.1/2.0/3.0/3.1/3.2, Vulkan® 1.1, OpenCL™ 2.1

NPU: 1 TOPs@INT8, support INT8, INT16, FP16, BFP16, support deep learning frameworks such as TensorFlow, Caffe, Tflite, Pytorch, Onnx, Android™ NN, etc.

RAM: 1GB LPDDR4

Memory: 32bit DDR4/3/3L/LPDDR4/4X/3 and support eMMC 5.1 and SFC

Display: Single display engine, HDMI2.0, eDP 1.3, Dual MIPI-DSI, combo with single LVDS, 24bit RGB/BT1120 and EBC interface

Multimedia: 4K H.265/H.264/VP9 video decoder and 1080p@60fps H.264/H.265 video encoder

Video input: 8M Pixel ISP and 1 x 4 lanes or 2 x 2 lanes MIPI CSI-2 and DVP interface

Audio interface: I2S0/I2S1 with 8 channels, IS2/I2S3 with 2 channels, SPDIF0, PDM0 with 8 channels, TDM) with 8 channels and Voice Activity Detection (VAD).

High-Speed Interface: One USB 3.0 host, two SATA 3.0, one PCIE2.1, two SerDes (serialiser/deserialiser) lanes, dual USB 2.0 host and one USB 2.0 OTG and a single RGMII interface

Security: Arm TrustZone® security extension, Secure Video Path, Secure JTAG to debug, Secure boot, OTP and Crypto (AES/TDES/SM4/SM3/SHA256/SHA512/RSA)

Power Requirements: the power input into the SoM is 5VDC at 5A.

Interfaces:

802.11 b/g/n/ac Wireless LAN (Wi-Fi 5)

Bluetooth 5.0 with BLE

8 x I2C

4 x SPI

8 x UART

9 x PWM

50 x GPIO

2 x ADC

1 x Gigabit Ethernet PHY

Support PDM with microphone array

I2S

2 x SATA

1 x PCIe 2.0, 1 lane host (5Gbps)

1 x USB 2.0

1 x USB 2.0 OTG

1 x USB 3.0 (5Gbps)

1 x SDIO 3.0

1 x HDMI up to 4K x 2k@60Hz

1 x eDP four lanes (2.7 Gbps per lane)

2 x MIPI DSI @ 1.6Gbps per lane

2 x MIPI CSI

1 x 2 lane MIPI CSI camera port

1 x 4 lane MIPI CSI camera port

1 x LVDS combo four lanes, mux with MIPI DSIO

eMMC size: 8GB

3 x 100 pins 0.4mm pitch B2B connector

Supported Software:

Debian/Ubuntu Linux support

Android 11 support

Attribute	Value
Product Name	ROCK 3 Compute Module (CM3) Model B 1GB/8GB WIFI/BT
RAM Size	1 GB
Model Number	Compute Module 3