Molex 1 mm Pitch 240 Way, 25° Through Hole Mount DDR3 Socket ,30V, 1A
- RS Stock No.:
- 691-844
- Mfr. Part No.:
- 78373-0011
- Manufacturer:
- Molex
N
Subtotal (1 tray of 15 units)*
HK$2,099.14
FREE delivery for orders over HK$250.00
Stocked by manufacturer
- Ready to ship from 03 September 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tray(s) | Per Tray | Per unit* |
|---|---|---|
| 1 + | HK$2,099.14 | HK$139.943 |
*price indicative
- RS Stock No.:
- 691-844
- Mfr. Part No.:
- 78373-0011
- Manufacturer:
- Molex
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Memory Socket Type | DIMM | |
| Product Type | Socket | |
| Insertion/Removal Method | Latched | |
| Orientation | 25° | |
| Contact Material | Copper Alloy | |
| Current | 1A | |
| Contact Plating | Gold | |
| Number of Contacts | 240 | |
| Pitch | 1mm | |
| Mount Type | Through Hole | |
| Housing Material | High Temperature Thermoplastic | |
| SDRAM Type | DDR3 | |
| Latching | Yes | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | IEC-62474 | |
| Series | 78373 | |
| Voltage | 30V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Memory Socket Type DIMM | ||
Product Type Socket | ||
Insertion/Removal Method Latched | ||
Orientation 25° | ||
Contact Material Copper Alloy | ||
Current 1A | ||
Contact Plating Gold | ||
Number of Contacts 240 | ||
Pitch 1mm | ||
Mount Type Through Hole | ||
Housing Material High Temperature Thermoplastic | ||
SDRAM Type DDR3 | ||
Latching Yes | ||
Minimum Operating Temperature -55°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals IEC-62474 | ||
Series 78373 | ||
Voltage 30V | ||
- COO (Country of Origin):
- SG
The Molex DDR3 DIMM Socket is designed for high-performance memory applications, offering reliability and versatility. Featuring a 1.00mm pitch and 240 circuit connections, this socket ensures seamless integration with 1.27mm JEDEC standard modules. With its black housing and bevelled metal pins, both functionality and aesthetics are prioritized. The product is constructed to accommodate a 2.79mm solder tail length, supporting robust PCB thicknesses of 1.57mm. Ideal for modern computing environments, this socket operates efficiently under a temperature range of -55° to +85°C, making it suitable for a variety of applications. The Durable design ensures longevity with a maximum mating cycle of 25, contributing to its status as an essential component in memory module connectivity.
1.00mm pitch ensures a Compact and efficient design
240 circuit capacity accommodates high density memory modules
Bevelled metal pins enhance durability and signal integrity
Black housing provides a sleek, modern appearance
Supports PCB thicknesses of 1.57mm for versatile applications
Lead-free process capability is compatible with contemporary manufacturing standards
Packaging type is tray, facilitating easy distribution and handling