Infineon DF300R07W2H3B77BPSA1 IGBT Module 650 V, Through Hole

The image is for reference only, please refer to product details and specifications

Bulk discount available

Subtotal (1 unit)*

HK$540.00

Add to Basket
Select or type quantity
In Stock
  • 7 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units
Per unit
1 - 1HK$540.00
2 - 5HK$527.00
6 - 7HK$514.40
8 - 11HK$502.10
12 +HK$490.00

*price indicative

Packaging Options:
RS Stock No.:
248-1198
Mfr. Part No.:
DF300R07W2H3B77BPSA1
Manufacturer:
Infineon
Find similar products by selecting one or more attributes.
Select all

Brand

Infineon

Product Type

IGBT Module

Maximum Collector Emitter Voltage Vceo

650V

Number of Transistors

4

Maximum Power Dissipation Pd

20mW

Mount Type

Through Hole

Minimum Operating Temperature

-40°C

Maximum Collector Emitter Saturation Voltage VceSAT

2V

Maximum Gate Emitter Voltage VGEO

20 V

Maximum Operating Temperature

150°C

Series

DF300R07W2H3_B77

Standards/Approvals

RoHS

Length

56.7mm

Height

12mm

Width

42.5 mm

Automotive Standard

No

The Infineon makes this EasyPACK 2B 650 V, 100 A 3-level IGBT module with Trench/Fieldstop IGBT H3 and rapid diode and PressFIT / NTC. This device offers easy of use compact design, optimized performance. The device provides added benefits like increased blocking voltage capability up to 650 V, low inductive design, low switching losses and low VCE,sat. It uses an Al2O3 substrate with low thermal resistance and PressFIT contact technology. This device offers rugged mounting due to integrated mounting clamp. This device has Booster configuration and uses IGBT HighSpeed 3 technology.

Best cost-performance ratio with reduced system costs

High degree of freedom in design

Highest efficiency and power density

Related links