TE Connectivity LGA Surface Prototyping IC Socket
- RS Stock No.:
- 185-8692
- Mfr. Part No.:
- 2299804-3
- Manufacturer:
- TE Connectivity
The image is for reference only, please refer to product details and specifications
Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 185-8692
- Mfr. Part No.:
- 2299804-3
- Manufacturer:
- TE Connectivity
Specifications
Product overview and Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Product Type | IC Socket | |
| Package Type | LGA | |
| IC Socket Type | Prototyping Socket | |
| Contact Material | Stainless Steel | |
| Device Mount Type | Surface | |
| Socket Mount Type | Surface | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Housing Material | Stainless Steel | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Product Type IC Socket | ||
Package Type LGA | ||
IC Socket Type Prototyping Socket | ||
Contact Material Stainless Steel | ||
Device Mount Type Surface | ||
Socket Mount Type Surface | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
Housing Material Stainless Steel | ||
TE Connectivity’s (TE) new LGA 3647 socket solution meets the next-generation designs of Intel’s new CPU processors for higher performance and better system scaling. As one of a limited number of suppliers of this technology, TE is your dependable socket partner to support current and future Intel CPU processor designs.
Two-piece design for increased reliability: First LGA socket to feature a two-piece design that improves issues with warpage and offers better coplanarity and reliability
Dependable partner: As new generations of chip platforms are developed, TE will offer the latest LGA sockets for your designs
APPLICATIONS
Servers
Data Centers
High Performance Computing (HPC)
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