Fischer Elektronik Heatsink, Universal Square Alu 14 mm 14 mm 14 mm
- RS Stock No.:
- 674-4740
- Mfr. Part No.:
- ICK PGA 6x6x14
- Manufacturer:
- Fischer Elektronik
Subtotal (1 unit)*
HK$19.60
Add 13 units to get free delivery
- 285 unit(s) ready to ship from another location
Units | Per unit |
|---|---|
| 1 - 49 | HK$19.60 |
| 50 - 99 | HK$19.30 |
| 100 - 249 | HK$18.70 |
| 250 + | HK$18.00 |
*price indicative
- RS Stock No.:
- 674-4740
- Mfr. Part No.:
- ICK PGA 6x6x14
- Manufacturer:
- Fischer Elektronik
Select all | Attribute | Value |
|---|---|---|
| Brand | Fischer Elektronik | |
| For Use With | Universal Square Alu | |
| Product Type | Heatsink | |
| Length | 14mm | |
| Width | 14 mm | |
| Height | 14mm | |
| Fastening | Conductive Foil | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | IC, BGA, LED, Slot, SMD, PGA | |
| Standards/Approvals | No | |
| Application | Heat Sink For Bga, Cooler, SMD, Fan, PGA, Microprocessor, Pentium, Semiconductor | |
| Material | Aluminium | |
| Special Features | Fan Motors Also Available With Other Operating Voltages and Pulse Output/alarm Device Circuit, Particularly Suited for Ball Grid Arrays, High Mechanical Stability, Long Product Life, Optimised Geometry for Low Weight, Other Pin Lengths and Surfaces on Request, Can Be Glued Directly on BGA Component, Heat Sink Dimensions Match Respective BGA Type, Effective Heat Dissipation, Custom Modifications and Special Designs, Excellent Thermal Conductivity, Low Current Consumption, High Reliability | |
| Select all | ||
|---|---|---|
Brand Fischer Elektronik | ||
For Use With Universal Square Alu | ||
Product Type Heatsink | ||
Length 14mm | ||
Width 14 mm | ||
Height 14mm | ||
Fastening Conductive Foil | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type IC, BGA, LED, Slot, SMD, PGA | ||
Standards/Approvals No | ||
Application Heat Sink For Bga, Cooler, SMD, Fan, PGA, Microprocessor, Pentium, Semiconductor | ||
Material Aluminium | ||
Special Features Fan Motors Also Available With Other Operating Voltages and Pulse Output/alarm Device Circuit, Particularly Suited for Ball Grid Arrays, High Mechanical Stability, Long Product Life, Optimised Geometry for Low Weight, Other Pin Lengths and Surfaces on Request, Can Be Glued Directly on BGA Component, Heat Sink Dimensions Match Respective BGA Type, Effective Heat Dissipation, Custom Modifications and Special Designs, Excellent Thermal Conductivity, Low Current Consumption, High Reliability | ||
- COO (Country of Origin):
- DE

ICK PGA Series
PGA Heatsinks
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