- RS Stock No.:
- 489-6091
- Mfr. Part No.:
- MBH31001-28W/2.6
- Manufacturer:
- Malico
The image is for reference only, please refer to product details and specifications
53 In stock for delivery within 3 working days
Added
Price Each
HK$60.24
| Units | Per unit |
| 1 - 99 | HK$60.24 |
| 100 - 249 | HK$57.83 |
| 250 - 499 | HK$55.43 |
| 500 + | HK$54.23 |
- RS Stock No.:
- 489-6091
- Mfr. Part No.:
- MBH31001-28W/2.6
- Manufacturer:
- Malico
Product overview and Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- TW
Product Details
BGA Chipset Heat Sinks
High-performance precision-forged clip-attachment heatsinks for BGA chipsets.
AL6063 grade aluminium at 201 W/m K thermal conductivity
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
BGA Heatsinks
Specifications
Attribute | Value |
|---|---|
| For Use With | Clip |
| Length | 31mm |
| Width | 31mm |
| Height | 28mm |
| Dimensions | 31 x 31 x 28mm |
| Mounting | Clip |
| Colour | Black |