- RS Stock No.:
- 262-9713
- Mfr. Part No.:
- TS256GMTE670T-I
- Manufacturer:
- Transcend
On back order for despatch 12/06/2024, delivery within 3 working days
Added
Price Each
HK$665.42
Units | Per unit |
1 + | HK$665.42 |
- RS Stock No.:
- 262-9713
- Mfr. Part No.:
- TS256GMTE670T-I
- Manufacturer:
- Transcend
Product overview and Technical data sheets
Legislation and Compliance
RoHS Status: Not Applicable
Product Details
Transcend 256GB M.2 2280 PCIe gen3 x4 Wide Temperature SSD - MTE670T-I
Transcend's M.2 SSD MTE670T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND
flash chips to be vertically stacked. Compared to 3D NAND at 96 layers, this density breakthrough greatly improves
storage efficiency. The MTE670T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM
Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30μ" gold finger
PCB and Corner Bond technology, the MTE670T is fully tested in-house to guarantee reliability in mission-critical
applications, boasting an endurance rating of 3K Program/Erase cycles and an wide operating temperature
ranging from -40℃ ∼ 85℃.
flash chips to be vertically stacked. Compared to 3D NAND at 96 layers, this density breakthrough greatly improves
storage efficiency. The MTE670T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM
Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30μ" gold finger
PCB and Corner Bond technology, the MTE670T is fully tested in-house to guarantee reliability in mission-critical
applications, boasting an endurance rating of 3K Program/Erase cycles and an wide operating temperature
ranging from -40℃ ∼ 85℃.
Hardware Features
Compliant with RoHS 2.0 standards Compliant with NVM Express specification 1.3 Compliant with PCI Express specification 3.1 Space-saving M.2 form factor (80mm) – ideal for mobile computing devices PCIe Gen 3 x4 interface
Firmware Features
SLC caching technology Built-in LDPC ECC (Error Correction Code) functionality Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices Advanced Garbage Collection Advanced Global Wear-Leveling and Block management for reliability
Specifications
Attribute | Value |
---|---|
Hard Drive Type | SSD |
Model | MTE670T-I |
Internal/External | Internal |
Industrial | Yes |
Form Factor | M.2 2280 |
Capacity | 256 GB |
Interface | NVMe PCIe Gen 3 x 4 |
Nand Type | 3D TLC |