Transcend's M.2 SSD MTE670T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 96 layers, this density breakthrough greatly improves storage efficiency. The MTE670T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30μ" gold finger PCB and Corner Bond technology, the MTE670T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃∼75℃. Transcend also offers the MTE670T-I with wide temperature (-40℃ ∼ 85℃) capabilities to ensure sustained functionality, enhanced endurance and optimal reliability in mission-critical applications
Hardware Features
Compliant with RoHS 2.0 standards Compliant with NVM Express specification 1.3 Compliant with PCI Express specification 3.1 Space-saving M.2 form factor (80mm) – ideal for mobile computing devices PCIe Gen 3 x4 interface
Firmware Features
SLC caching technology Built-in LDPC ECC (Error Correction Code) functionality Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices Advanced Garbage Collection Advanced Global Wear-Leveling and Block management for reliability
