Okdo Bulk ROCK 3 Compute Module SODIMM (CM3 SODIMM) Model A 2GB/32GB Wi-Fi/BT - Box of 50

RS Stock No.:: 261-9843
Mfr. Part No.:: RM117-D2E32W3
Manufacturer:: Okdo

Bulk discount available

Subtotal (1 box of 500 units)**

HK$151,802.00

2500 In stock for delivery within 3 working days*

* Delivery dates may change based on your chosen quantity and delivery address.

FREE delivery for orders over HK$250.00

Real time qty checker

Units	Per unit	Per Box**
500 - 500	HK$303.604	HK$151,802.00
1000 - 1000	HK$294.274	HK$147,137.00
1500 +	HK$282.87	HK$141,435.00

**price indicative

RS Stock No.:: 261-9843
Mfr. Part No.:: RM117-D2E32W3
Manufacturer:: Okdo

Datasheet RM117-D2E32W3

The OKdo ROCK 3 Compute Module SODIMM (CM3S) Model A is a highly impressive device that offers an array of features within its compact design. It’s based on the Rockchip RK3566 System on Chip (SoC), which boasts a robust CPU, a Power Management Unit (PMU), DRAM memory, eMMC storage, as well as wireless connectivity through WiFi 4 and BT 4.2. All these components are packed into a compact DDR2 SODIMM form factor, measuring just 67.6mm x 32mm.

The CM3S is a cost-effective, and highly versatile solution for a wide range of applications. Despite its small size, this device is a true powerhouse. This variant offers 2GB of LPDDR4 RAM and a 32GB eMMC storage, as well as Wi-Fi and Bluetooth configuration.

The CM3S accelerates product development by providing a powerful SoM in a compact form factor. With a simple carrier board (a 2-layer baseboard is sufficient to provide access to all functions of the SoM), engineers can rapidly develop solutions and prepare the boards for production.

Please note: The images above show a CM3S-specific model. This model has certain features like wireless communication capabilities or eMMC. Depending on the purchased SKU there might be variations to the populated components.

Hardware

CPU: Quad‑core Arm® Cortex®‑A55 (ARMv8) 64‑bit @ 1.6GHz

GPU: Arm Mali™‑G52‑2EE, OpenGL® ES1.1/2.0/3.0/3.1/3.2, Vulkan® 1.1, OpenCL™ 2.1

NPU: 0.8 TOPs@INT8, support INT8, INT16, FP16, BFP16, support deep learning frameworks such as TensorFlow, Caffe, Tflite, Pytorch, Onnx, Android™ NN, etc

Memory: 32bit LPDDR4X 2GB

Storage: eMMC 5.1 32GB

Display: Single display engine, HDMI2.0, Dual MIPI‑DSI

Multi‑Media: 4K H.265/H.264/VP9 video decoder and 1080p@60fps H.264/H.265 video encoder

Video input: 8M Pixel ISP and 1 x 4 lanes or 2 x 2 lanes MIPI CSI‑2 and DVP interface

Audio interface: I2S0/I2S1 with 8 channels, IS2/I2S3 with 2 channels

High-Speed Interface: One SATA 3.0/PCIe 2.1 combo port, and one USB 2.0 OTG

Security: Arm TrustZone® security extension, Secure Video Path, Secure JTAG to de-bug, Secure boot, OTP and Crypto (AES/TDES/SM4/SM3/SHA256/SHA512/RSA)

Interfaces

802.11 b/g/n Wireless LAN (Wi‑Fi 4)

BT 4.2 with BLE

up to 5 x I2C

up to 3 x SPI

up to 8 x UART

up to 12 x PWM

up to 60x GPIO

1 x ADC

2 x I2S

1 x PCIe 2.0, 1 lane host (5Gbps)

1 x SATA 3.0(shared with PCIe)

1 x USB 2.0 OTG

1 x SDIO 3.0

1 x HDMI up to 4K x 2k@60Hz

2 x 2 lane or 1 x 4 lane MIPI CSI camera port

1 x MIPI DSI 2 lane @ 1.6Gbps per lane

1 x MIPI DSI 4 lane @ 1.6Gbps per lane

3.3V ∼ 5V power input

260 pins SODIMM golden finger edge connector

Let's work together

OKdo has manufacturing capabilities and technical engineering consultants to support long-term stock availability and design longevity. If you would like to collaborate on your next project, let’s design the future together: contact sales@okdo.com

Attribute	Value
Product Name	Bulk ROCK 3 Compute Module SODIMM (CM3 SODIMM) Model A 2GB/32GB Wi-Fi/BT - Box of 50
RAM Size	2 GB
Model Number	CM3S