Amphenol FCI 400 SMT Prototyping Socket, BGA

  • RS Stock No. 182-2279
  • Mfr. Part No. 74221-101LF
  • Manufacturer Amphenol FCI
Product overview and Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): US
Product Details

High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options

400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free

Specifications
Attribute Value
IC Socket Type Prototyping Socket
Package Type BGA
Gender Female
Number of Contacts 400
Contact Material Copper Alloy
Contact Plating Gold
Current Rating 450.0mA
Socket Mounting Type Surface Mount
Device Mounting Type Surface Mount
Voltage Rating 200.0 V
Termination Method Through Hole
Housing Material Liquid Crystal Polymer
250 In stock for delivery within 3 working days
Price Each (On a Reel of 250)
Was HK$238.663
HK$ 201.571
(exc. GST)
units
Per unit
Per Reel*
250 +
HK$201.571
HK$50,392.75
*price indicative
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