TE Connectivity Z-PACK HM-Zd Series 2.5mm Pitch 3 Pair, High Speed Hard Metric Backplane Connector, Male, Straight

Product overview and Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): CN
Product Details

TE Connectivity Z-PACK™ HM-Zd Headers and Connector Assemblies

Z-PACK™ HM-Zd headers and connector assemblies with a 2.50mm centerline. These Z-PACK™ HM-Zd Pin headers and receptacle connector assemblies are press fit PCB through hole mounting and have polyester GF housings.

HM-Zd is the backplane interconnect for PICMG 3.x (ATCA) industry standard
High speed, differential, board to backplane electrical connectors
Provides a differential solution for applications in the range 3 to 6.4 Gb/s
Extension of IEC61076-4-101

Standards

PICMG

The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.

Specifications
Attribute Value
Backplane Connector Type High Speed Hard Metric, 3 Pair
Gender Male
Number of Contacts 60
Number of Columns 10
Number of Rows 3
Body Orientation Straight
Housing Material PET
Pitch 2.5mm
Contact Material Phosphor Bronze
Contact Plating Tin over Nickel
Current Rating 7A
Voltage Rating 250 V ac
Termination Method Solder
Series Z-PACK HM-Zd
Maximum Operating Temperature +105°C
Minimum Operating Temperature -65°C
20 In stock for delivery within 3 working days
Price Each
HK$ 93.01
(exc. GST)
units
Per unit
1 - 14
HK$93.01
15 - 49
HK$79.02
50 - 99
HK$74.52
100 - 249
HK$70.02
250 +
HK$65.06
Packaging Options:
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